ChipMOS TECHNOLOGIES INC
ChipMOS TECHNOLOGIES INC. engages in the research and development, manufacture, and sale of integrated circuits, and related assembly and testing services in Taiwan, Japan, the People's Republic of China, Singapore, and internationally. The company operates through five segments: Testing, Assembly, Display Panel Driver Semiconductor Assembly and Testing (LCDD), Bumping, and Others. It offers a range of back-end testing services for high density memory, mixed-signal, and display driver semiconductors; and packaging solutions, such as small outline package, thin small outline package, quad flat package, and substrate-based packages. The company also provides testing solutions for the entire spectrum of integrated circuits, including simple digital logic, complex ASIC, high speed digital, memory, and mixed signal and display driver IC (DDIC) devices. In addition, it offers bumping services, including gold bumping, metal composite bumping, ball drop, copper re-distribution layer, and copper pillar technology. Further, the company provides wafer-level chip scale packaging technology for IC chips in the form of wafer; and turnkey solutions, including wafer bumping/RDL, wafer sort, assembly, final test, and drop shipment. Its semiconductors are used in personal computers, communications equipment, office automation, and consumer electronics. The company was incorporated in 1997 and is headquartered in Hsinchu City, Taiwan.
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Micron Technology, Inc. designs, develops, manufactures, and sells memory and storage products in the United States, Taiwan, Singapore, Japan, Malaysia, China, India, and internationally. It operates through the Cloud Memory Business Unit (CMBU); Core Data Center Business Unit (CDCBU); Mobile and Client Business Unit (MCBU); and Automotive and Embedded Business Unit (AEBU) segments. The company provides memory products, including dynamic random access memory components and modules, CXL-based memory, LPDDR components and modules, graphics memory, high-bandwidth memory, and data center memory products; multichip packages (MCP) comprising embedded multimedia cards-based, universal flash storage-based, and NAND-based MCPs; and technology leadership products that include 1y DRAM and G9 NAND technologies. It also offers storage products, such as data center solid state drive (SSD), client SSD storage, and auto and industrial SSD storage; managed NAND; NAND flash; NOR flash; and memory cards. In addition, the company provides design tools, including FBGA and part decoder; DRAM power calculators; NAND power calculators; simulation models; chipset compatibility guides; serial presence-detection tools; cross-reference tools; UFSparm; SSD firmware; software and drivers; storage executive software; and obsolete part catalogs. It markets its semiconductor memory and storage products under the Micron and Crucial brands. The company serves the data center, PC, graphics, networking, automotive, industrial, and consumer embedded markets, as well as for smartphone and other mobile-device markets. It sells its products through its direct sales force, independent sales representatives, distributors, and retailers; web-based customer direct sales channel; and channel and distribution partners. Micron Technology, Inc. was founded in 1978 and is headquartered in Boise, Idaho.
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