ChipMOS TECHNOLOGIES INC
ChipMOS TECHNOLOGIES INC. engages in the research and development, manufacture, and sale of integrated circuits, and related assembly and testing services in Taiwan, Japan, the People's Republic of China, Singapore, and internationally. The company operates through five segments: Testing, Assembly, Display Panel Driver Semiconductor Assembly and Testing (LCDD), Bumping, and Others. It offers a range of back-end testing services for high density memory, mixed-signal, and display driver semiconductors; and packaging solutions, such as small outline package, thin small outline package, quad flat package, and substrate-based packages. The company also provides testing solutions for the entire spectrum of integrated circuits, including simple digital logic, complex ASIC, high speed digital, memory, and mixed signal and display driver IC (DDIC) devices. In addition, it offers bumping services, including gold bumping, metal composite bumping, ball drop, copper re-distribution layer, and copper pillar technology. Further, the company provides wafer-level chip scale packaging technology for IC chips in the form of wafer; and turnkey solutions, including wafer bumping/RDL, wafer sort, assembly, final test, and drop shipment. Its semiconductors are used in personal computers, communications equipment, office automation, and consumer electronics. The company was incorporated in 1997 and is headquartered in Hsinchu City, Taiwan.
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Lattice Semiconductor Corporation, together with its subsidiaries, develops and sells semiconductor, silicon-based and silicon-enabling, evaluation boards, and development hardware products in Asia, Europe, and the Americas. The company offers field programmable gate arrays (FPGA), which are regular arrays of logic that can be custom-configured by the user through software. Its products include small FPGA platforms, including Lattice Nexus and Lattice Nexus 2; Lattice Avant, a mid-range FPGA platform; general purpose FPGA, such as Lattice Avant-G, Avant-E, Avant-X, Certus, and ECP; and specialized FPGAs, which includes Lattice Mach, iCE, and CrossLink. The company also provides design software that includes Lattice Radiant to deliver tools that enable predictable design convergence; Lattice Propel for creating embedded processor-based designs; develops Lattice Automate for industrial automation and robotics; Lattice mVision forlow power embedded vision; Lattice ORAN for control data security, fronthaul synchronization, and low power hardware acceleration; Lattice sensAI for Edge AI applications; Lattice Sentry for hardware security implementation; and Lattice Drive for automotive system designs and applications. In addition, it offers Glance, an edge AI application software that allows users to control the AI and computer vision experiences for various edge applications, including client computing, industrial, and automotive applications; and sells video connectivity application specific standard products. Further, the company provides standard IP and IP core licensing, patent monetization, and IP services. It serves communications and computing, industrial and automotive, and consumer markets. Lattice Semiconductor Corporation was incorporated in 1983 and is headquartered in Hillsboro, Oregon.
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