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CEVA vs IMOS

CEVA Inc. and ChipMOS TECHNOLOGIES INC

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CEVA Inc.

CEVA, Inc. provides silicon and software intellectual property (IP) solutions to semiconductor and original equipment manufacturer companies in the United States, Europe, the Middle East, the Asia Pacific, and internationally. The company offers PentaG2, a 5G/5G-A baseband platform; PentaG-RAN, a hardware and software IP for implementing L1 PHY baseband processing in 5G and 5G-A base station and other cellular infrastructure system-on-chips (SoCs); Ceva-XC20 communication vector digital signal processors (DSP) for 5G-A handsets, 5G-A RAN, and general purpose baseband processing; Ceva-BX2 baseband processor; Ceva-Waves Bluetooth platform, a set of hardware IP, software modules, and radios addressing a range of processes and nodes; Ceva-Waves Wi-Fi platform, a set of hardware IP and CPU-agnostic host software for energy-efficient SoC implementation of Wi-Fi subsystems; Ceva-Waves ultra-wideband platform; Ceva-Waves Links, which provide solutions for SoCs requiring multiple connectivity standards; and Ceva-Waves DragonFly, a turnkey platform for implementing NB-IoT cellular modem SoCs. It also provides Ceva-SensPro, a family of DSP cores; Ceva-BX1 audio digital signal controller IP; Ceva-ClearVox ENC software, a neural-network-based noise cancellation; Ceva-RealSpace, a spatial audio and head tracking software solution; and Ceva-MotionEngine, a sensor fusion software. In addition, it offers Ceva-NeuPro-M, a neural processing unit (NPU) IP for generative AI; a Ceva-NeuPro-Nano, an NPU IP for embedded AI; and Ceva-NeuPro Studio, a software development environment for the development and deployment of AI models on the Ceva-NeuPro NPUs. The company was formerly known as ParthusCeva, Inc. and changed its name to CEVA, Inc. in December 2003. The company was incorporated in 1999 and is headquartered in Rockville, Maryland.

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ChipMOS TECHNOLOGIES INC

ChipMOS TECHNOLOGIES INC. engages in the research and development, manufacture, and sale of integrated circuits, and related assembly and testing services in Taiwan, Japan, the People's Republic of China, Singapore, and internationally. The company operates through five segments: Testing, Assembly, Display Panel Driver Semiconductor Assembly and Testing (LCDD), Bumping, and Others. It offers a range of back-end testing services for high density memory, mixed-signal, and display driver semiconductors; and packaging solutions, such as small outline package, thin small outline package, quad flat package, and substrate-based packages. The company also provides testing solutions for the entire spectrum of integrated circuits, including simple digital logic, complex ASIC, high speed digital, memory, and mixed signal and display driver IC (DDIC) devices. In addition, it offers bumping services, including gold bumping, metal composite bumping, ball drop, copper re-distribution layer, and copper pillar technology. Further, the company provides wafer-level chip scale packaging technology for IC chips in the form of wafer; and turnkey solutions, including wafer bumping/RDL, wafer sort, assembly, final test, and drop shipment. Its semiconductors are used in personal computers, communications equipment, office automation, and consumer electronics. The company was incorporated in 1997 and is headquartered in Hsinchu City, Taiwan.

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