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ASYS vs CAMT

Amtech Systems Inc and Camtek Ltd

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Amtech Systems Inc

Amtech Systems, Inc., together with its subsidiaries, manufactures and sells capital equipment and related consumables for use in fabricating and packaging semiconductor devices in the United States, Canada, Mexico, China, Malaysia, Taiwan, Singapore, the Czech Republic, Austria, Hungary, the United Kingdom, Germany, and internationally. It operates through Thermal Processing Solutions and Semiconductor Fabrication Solutions segments. The company offers thermal processing equipment for use in solder reflow operations for advanced semiconductor packaging and electronics assembly; belt furnaces for producing power semiconductor packaging substrates and electronic components; and horizontal diffusion furnaces for use in wafer processing. It also provides double-sided wafer cleaning systems, entegrity head testers, substrate carriers, substrate polishing templates, substrate process chemicals, wafer processing lubricants, and coolants under the Entrepix, PR Hoffman, and Intersurface Dynamics brands. The company sells its products to semiconductor substrate, device, and electronic assembly manufacturers, as well as ceramics and optics industries through sales personnel and a network of independent sales representatives and distributors. Amtech Systems, Inc. was incorporated in 1981 and is headquartered in Tempe, Arizona.

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Camtek Ltd

Camtek Ltd., together with its subsidiaries, develops, manufactures, and sells inspection and metrology equipment for semiconductor industry in the United States, China, Korea, Europe, and the Asia Pacific. The company offers Hawk, a platform engineered for advanced packaging; Eagle G5 for enhanced detection and metrology; Eagle-i, a system that delivers 2D inspection and metrology capabilities; Eagle-AP, which addresses the advanced packaging market using software and hardware technologies that deliver 2D and 3D inspection and metrology capabilities on the same platform; and Golden Eagle, a panel inspection and metrology system to address the challenges fanout wafer level packaging applications, as well as automatic defect classification for color images utilizing deep learning techniques to reduce and eliminate manual verification. It also develops MicroProf AP, a wafer metrology tool for applications at 3D packaging process steps; MicroProf DI, an optical inspection tool that enables inspection of structured and unstructured wafers; MicroProf FE, a 2D/3D wafer metrology tool; MicroProf FS, a wafer metrology tool configurable; MicroProf PT for hybrid metrology applications to common panel sizes; MicroProf MHU metrology tool, a material handling unit for the semiconductor, MEMS, sapphire, and LED industries; MicroProf TL, an optical surface measurement tool for fully automatic 3D surface measurements; MicroProf 200, a measuring device for contactless and non-destructive characterization of surfaces and films; and MicroProf 300, a SurfaceSens technology for quality assurance, development, and manufacturing. The company serves semiconductor manufacturers, outsourced semiconductor assembly and test, integrated device manufacturers, and wafer level packaging subcontractors. Camtek Ltd. was incorporated in 1987 and is headquartered in Migdal HaEmek, Israel.

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