ASE Technology Holding Co., Ltd.
ASE Technology Holding Co., Ltd., together with its subsidiaries, provides semiconductor manufacturing services in assembly and testing in the United States, Taiwan, Europe, Asia, and internationally. It operates through Packaging, Testing, EMS, and Others segments. The company offers semiconductor packaging, production of interconnect materials, front-end engineering testing, wafer probing, and final testing services, as well as integrated solutions for EMS (electronic manufacturing services) in relation to computing, peripherals, communications, industrial, automotive, and server applications. It also provides turnkey services, which comprise packaging, testing, and direct shipment of semiconductors to end users; wirebonding, including lead frame-based packages and substrate-based packages; advanced packages; heterogeneous integration; and other test-related services. In addition, the company engages in the social; marketing and sales; information software; leasing and investing; after-sales service and sales support; leasing of properties; development, construction, sale, and management of real estate properties; management of parking lot; leasing of properties for shopping center; and management of commercial complex services and department store trading activities. Further, it undertakes production of substrates; investment advisory and warehousing management; design and manufacturing of electronic components and new electronic applications; technical advisory services; management, training, and consulting of organization and human resources; projection of plastic; manufacturing and sale of antennas, RF amplifiers and wave straps, PCBs, and tuners; and research and development activities. ASE Technology Holding Co., Ltd. was founded in 1984 and is based in Kaohsiung, Taiwan.
Open ASX dashboard ↗Teledyne Technologies Incorporated
Teledyne Technologies Incorporated provides enabling technologies for industrial growth markets in the United States, Europe, Asia, and internationally. Its Digital Imaging segment provides visible spectrum sensors and digital cameras; and infrared, ultraviolet, visible, and X-ray spectra products, as well as micro electromechanical systems and semiconductors, including analog-to-digital and digital-to-analog converters. This segment offers cooled and uncooled infrared or thermal products, including sensors, camera cores, and camera systems; high-resolution, low-dose X-ray sensors, high-power microwave, and high-energy X-ray subsystems; and instruments for the measurement of physical properties and maritime products, as well as develops and manufactures multi-spectrum electro-optic/infrared imaging systems and associated products, such as lasers, optics, and radars, CBRNE (Chemical, Biological, Radiological, Nuclear and Explosive detectors), and unmanned air and ground systems. The company's Instrumentation segment offers monitoring, control, and electronic test and measurement equipment; and power and communications connectivity devices for distributed instrumentation systems and sensor networks. The company's Aerospace and Defense Electronics segment provides electronic components and subsystems, data acquisition and communications components and equipment, harsh environment interconnects, general aviation batteries, and other components; and onboard avionics systems and ground-based applications, aircraft data and connectivity solutions, hardware systems, and software applications. Its Engineered Systems segment offers systems engineering and integration, technology development, and manufacturing solutions for defense, space, environmental, and energy applications; and designs and manufactures electrochemical energy systems and electronics for military applications. The company was founded in 1960 and is headquartered in Thousand Oaks, California.
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