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ASX vs IMOS

ASE Technology Holding Co., Ltd. and ChipMOS TECHNOLOGIES INC

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ASE Technology Holding Co., Ltd.

ASE Technology Holding Co., Ltd., together with its subsidiaries, provides semiconductor manufacturing services in assembly and testing in the United States, Taiwan, Europe, Asia, and internationally. It operates through Packaging, Testing, EMS, and Others segments. The company offers semiconductor packaging, production of interconnect materials, front-end engineering testing, wafer probing, and final testing services, as well as integrated solutions for EMS (electronic manufacturing services) in relation to computing, peripherals, communications, industrial, automotive, and server applications. It also provides turnkey services, which comprise packaging, testing, and direct shipment of semiconductors to end users; wirebonding, including lead frame-based packages and substrate-based packages; advanced packages; heterogeneous integration; and other test-related services. In addition, the company engages in the social; marketing and sales; information software; leasing and investing; after-sales service and sales support; leasing of properties; development, construction, sale, and management of real estate properties; management of parking lot; leasing of properties for shopping center; and management of commercial complex services and department store trading activities. Further, it undertakes production of substrates; investment advisory and warehousing management; design and manufacturing of electronic components and new electronic applications; technical advisory services; management, training, and consulting of organization and human resources; projection of plastic; manufacturing and sale of antennas, RF amplifiers and wave straps, PCBs, and tuners; and research and development activities. ASE Technology Holding Co., Ltd. was founded in 1984 and is based in Kaohsiung, Taiwan.

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ChipMOS TECHNOLOGIES INC

ChipMOS TECHNOLOGIES INC. engages in the research and development, manufacture, and sale of integrated circuits, and related assembly and testing services in Taiwan, Japan, the People's Republic of China, Singapore, and internationally. The company operates through five segments: Testing, Assembly, Display Panel Driver Semiconductor Assembly and Testing (LCDD), Bumping, and Others. It offers a range of back-end testing services for high density memory, mixed-signal, and display driver semiconductors; and packaging solutions, such as small outline package, thin small outline package, quad flat package, and substrate-based packages. The company also provides testing solutions for the entire spectrum of integrated circuits, including simple digital logic, complex ASIC, high speed digital, memory, and mixed signal and display driver IC (DDIC) devices. In addition, it offers bumping services, including gold bumping, metal composite bumping, ball drop, copper re-distribution layer, and copper pillar technology. Further, the company provides wafer-level chip scale packaging technology for IC chips in the form of wafer; and turnkey solutions, including wafer bumping/RDL, wafer sort, assembly, final test, and drop shipment. Its semiconductors are used in personal computers, communications equipment, office automation, and consumer electronics. The company was incorporated in 1997 and is headquartered in Hsinchu City, Taiwan.

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