Arbe Robotics Ltd. Ordinary Shares
Arbe Robotics Ltd., a semiconductor company, provides 4D imaging radar solutions to suppliers of parts or systems, autonomous ground vehicles, and commercial and industrial vehicles in China, Sweden, Germany, the United States, Israel, and internationally. It offers a radar chipset, including transmitter (Tx), receiver (Rx), and processor chips; the Phoenix perception radar for free space mapping, object tracking, and simultaneous localization and mapping; and Lynx, a 4D imaging radar for corner and back installation. The company also develops radar chipsets for integration into advanced driver assistance systems (ADAS) and autonomous vehicles (AV) sensor suites, as well as an array of safety applications with sensing and paradigm-changing perception. Further, it develops multi-channel radio frequency integrated circuit. The company was founded in 2015 and is headquartered in Tel Aviv-Yafo, Israel.
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ChipMOS TECHNOLOGIES INC. engages in the research and development, manufacture, and sale of integrated circuits, and related assembly and testing services in Taiwan, Japan, the People's Republic of China, Singapore, and internationally. The company operates through five segments: Testing, Assembly, Display Panel Driver Semiconductor Assembly and Testing (LCDD), Bumping, and Others. It offers a range of back-end testing services for high density memory, mixed-signal, and display driver semiconductors; and packaging solutions, such as small outline package, thin small outline package, quad flat package, and substrate-based packages. The company also provides testing solutions for the entire spectrum of integrated circuits, including simple digital logic, complex ASIC, high speed digital, memory, and mixed signal and display driver IC (DDIC) devices. In addition, it offers bumping services, including gold bumping, metal composite bumping, ball drop, copper re-distribution layer, and copper pillar technology. Further, the company provides wafer-level chip scale packaging technology for IC chips in the form of wafer; and turnkey solutions, including wafer bumping/RDL, wafer sort, assembly, final test, and drop shipment. Its semiconductors are used in personal computers, communications equipment, office automation, and consumer electronics. The company was incorporated in 1997 and is headquartered in Hsinchu City, Taiwan.
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