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AMPG vs IMOS

AMPLITECH GROUP INC. COM and ChipMOS TECHNOLOGIES INC

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AMPLITECH GROUP INC. COM

AmpliTech Group, Inc. designs, engineers, and assembles micro-wave component-based amplifiers. It operates in two segments; Manufacturing and Engineering and Distribution. The company's products include radio frequency (RF) amplifiers and related subsystems, such as low noise amplifiers for use in receivers of various communication systems comprising Wi-Fi, radar, satellite, base station, cell phone, radio, etc.; and medium power amplifiers that provide enhanced output power and gain in transceiver chains. It also specialty microwave block downconverters used as a test device on satellite access point antennas; specialty microwave 1:2 Tx protection switch panels that is used in satellite communication earth stations; desktop/benchtop and compact wideband power amplifiers used in SATCOM rack mount systems, as well as test equipment used in integrators and manufacturers of various communications systems, such as cellular base stations, simulators, and point to point wireless radios; and waveguide to coaxial adapters for SATCOM and satellite internet gateway systems. In addition, the company offers cryogenic amplifiers for quantum computing, medical, RF imaging, research and development, space communications, accelerators, radiometry, and telephony applications; and cryogenic and non-cryogenic 4g/5g small cell subsystems for high-speed networks and airline Wi-Fi systems. Further, the company provides custom assembly designs and non-recurring engineering services on a project-by-project basis, as well as IC packaging and lids products for semiconductor device assembly, prototyping, testing, and production requirements. It serves aerospace, government, defense, commercial satellite, and wireless industries through sales representatives and distributors in the United States, Europe, the Middle East, and South Asia. AmpliTech Group, Inc. was founded in 2002 and is based in Hauppauge, New York.

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ChipMOS TECHNOLOGIES INC

ChipMOS TECHNOLOGIES INC. engages in the research and development, manufacture, and sale of integrated circuits, and related assembly and testing services in Taiwan, Japan, the People's Republic of China, Singapore, and internationally. The company operates through five segments: Testing, Assembly, Display Panel Driver Semiconductor Assembly and Testing (LCDD), Bumping, and Others. It offers a range of back-end testing services for high density memory, mixed-signal, and display driver semiconductors; and packaging solutions, such as small outline package, thin small outline package, quad flat package, and substrate-based packages. The company also provides testing solutions for the entire spectrum of integrated circuits, including simple digital logic, complex ASIC, high speed digital, memory, and mixed signal and display driver IC (DDIC) devices. In addition, it offers bumping services, including gold bumping, metal composite bumping, ball drop, copper re-distribution layer, and copper pillar technology. Further, the company provides wafer-level chip scale packaging technology for IC chips in the form of wafer; and turnkey solutions, including wafer bumping/RDL, wafer sort, assembly, final test, and drop shipment. Its semiconductors are used in personal computers, communications equipment, office automation, and consumer electronics. The company was incorporated in 1997 and is headquartered in Hsinchu City, Taiwan.

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