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AMBA vs IMOS

Ambarella, Inc. Ordinary Shares and ChipMOS TECHNOLOGIES INC

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Ambarella, Inc. Ordinary Shares

Ambarella, Inc. develops semiconductor solutions that enable artificial intelligence (AI) processing, advanced image signal processing, and high-definition (HD) and ultra-HD compression. The company's system-on-a-chip (SOC) designs integrated HD video processing, image processing, AI algorithms, audio processing, and system functions onto a single chip for delivering video and image quality, differentiated functionality, and low power consumption. It also offers central domain controllers, CVflow SoCs, AI neural processors, vision processor SoCs, HD radars, and serializer/deserializers, as well as licenses software modules. The company's solutions are used in automotive video recorders, electronic mirrors, front advanced driver assistance system camera, and cabin monitoring system and driver monitoring system cameras in automotive field; central domain controllers for autonomous vehicles in autonomy; enterprise and public class, and home security cameras in the field of IoT; and robotics and industrial applications, including identification/authentication cameras, robotic products, and sensing cameras, as well as cameras for the enterprise, home, public spaces, and consumer leisure comprising wearable body cameras, sports action cameras, social media cameras, drones for capturing aerial video or photographs, video conferencing, and virtual reality applications. It sells its solutions to original design manufacturers and original equipment manufacturers through its direct sales force and distributors. The company operates in Taiwan, rest of the Asia Pacific, Europe, the United States, and rest of North America. Ambarella, Inc. was incorporated in 2004 and is headquartered in Santa Clara, California.

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ChipMOS TECHNOLOGIES INC

ChipMOS TECHNOLOGIES INC. engages in the research and development, manufacture, and sale of integrated circuits, and related assembly and testing services in Taiwan, Japan, the People's Republic of China, Singapore, and internationally. The company operates through five segments: Testing, Assembly, Display Panel Driver Semiconductor Assembly and Testing (LCDD), Bumping, and Others. It offers a range of back-end testing services for high density memory, mixed-signal, and display driver semiconductors; and packaging solutions, such as small outline package, thin small outline package, quad flat package, and substrate-based packages. The company also provides testing solutions for the entire spectrum of integrated circuits, including simple digital logic, complex ASIC, high speed digital, memory, and mixed signal and display driver IC (DDIC) devices. In addition, it offers bumping services, including gold bumping, metal composite bumping, ball drop, copper re-distribution layer, and copper pillar technology. Further, the company provides wafer-level chip scale packaging technology for IC chips in the form of wafer; and turnkey solutions, including wafer bumping/RDL, wafer sort, assembly, final test, and drop shipment. Its semiconductors are used in personal computers, communications equipment, office automation, and consumer electronics. The company was incorporated in 1997 and is headquartered in Hsinchu City, Taiwan.

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