Arteris, Inc. Common Stock
Arteris, Inc., together with its subsidiaries, provides semiconductor system intellectual property solutions in the United States, rest of the Americas, China, Korea, the rest of the Asia Pacific, Europe, and the Middle East. It manages on-chip communications and IP block deployments in System-on-Chip (SoC) semiconductors and systems of chiplets. The company offers Network-on-Chip (NoC) IP Products, such as FlexGen, FlexNoC, and FlexWay, a non-coherent NoC IP; Ncore, a cache-coherent NoC IP; and CodaCache, a last-level cache. It also provides SoC integration automation software solutions products that includes Magillem (Connectivity and Registers) and CSRCompiler, an IP and SoC software. In addition, the company offers professional services, such as training, design assistance, and consulting; licensing services for software and intellectual properties; IP support and maintenance; and on-site support services. It serves the automotive, communications, enterprise computing, consumer electronics, and industrial industries. Arteris, Inc. was founded in 2003 and is headquartered in Campbell, California.
Open AIP dashboard ↗ChipMOS TECHNOLOGIES INC
ChipMOS TECHNOLOGIES INC. engages in the research and development, manufacture, and sale of integrated circuits, and related assembly and testing services in Taiwan, Japan, the People's Republic of China, Singapore, and internationally. The company operates through five segments: Testing, Assembly, Display Panel Driver Semiconductor Assembly and Testing (LCDD), Bumping, and Others. It offers a range of back-end testing services for high density memory, mixed-signal, and display driver semiconductors; and packaging solutions, such as small outline package, thin small outline package, quad flat package, and substrate-based packages. The company also provides testing solutions for the entire spectrum of integrated circuits, including simple digital logic, complex ASIC, high speed digital, memory, and mixed signal and display driver IC (DDIC) devices. In addition, it offers bumping services, including gold bumping, metal composite bumping, ball drop, copper re-distribution layer, and copper pillar technology. Further, the company provides wafer-level chip scale packaging technology for IC chips in the form of wafer; and turnkey solutions, including wafer bumping/RDL, wafer sort, assembly, final test, and drop shipment. Its semiconductors are used in personal computers, communications equipment, office automation, and consumer electronics. The company was incorporated in 1997 and is headquartered in Hsinchu City, Taiwan.
Open IMOS dashboard ↗