ACM Research, Inc. Class A Common Stock
ACM Research, Inc., together with its subsidiaries, develops, manufactures, and sells capital equipment worldwide. It also develops, manufactures, and sells a range of packaging tools to wafer assembly and packaging customers. The company provides Wet Cleaning Equipment for Front End Production Processes; Ultra C SAPS II and Ultra C SAPS V which are a single-wafer, serial-processing tool used to remove random defects from wafer surfaces or interconnects and barrier metals as part of the chip front-end fabrication process or for recycling test wafers; and Ultra C TEBO II and Ultra C TEBO V, a single-wafer, serial-processing tool used at numerous manufacturing processing steps for cleaning of chips at process nodes of 28nm or less. In addition, it offers Ultra-C Tahoe wafer cleaning tool that delivers high cleaning performance using significantly less sulfuric acid and hydrogen peroxide than is typically consumed by conventional high-temperature single-wafer cleaning tools; and advanced packaging tools, such as coaters, developers, photoresist strippers, scrubbers, wet etchers, and copper-plating tools. Further, the company provides e Ultra fn Furnace, a dry processing tool; Ultra Pmax" PECVD tool, for film uniformity; Ultra Track tool, a 300mm process tool that delivers air downflow, robot handling, and customizable software to address specific customer requirements; and a suite of semi-critical cleaning systems which include single wafer back side cleaning, scrubber, and auto bench cleaning tools. It markets and sells its products under the SAPS, TEBO, ULTRA C, ULTRA Fn, Ultra ECP, Ultra ECP map, and Ultra ECP ap trademarks through direct sales force and third-party representatives. ACM Research, Inc. was incorporated in 1998 and is headquartered in Fremont, California.
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CEVA, Inc. provides silicon and software intellectual property (IP) solutions to semiconductor and original equipment manufacturer companies in the United States, Europe, the Middle East, the Asia Pacific, and internationally. The company offers PentaG2, a 5G/5G-A baseband platform; PentaG-RAN, a hardware and software IP for implementing L1 PHY baseband processing in 5G and 5G-A base station and other cellular infrastructure system-on-chips (SoCs); Ceva-XC20 communication vector digital signal processors (DSP) for 5G-A handsets, 5G-A RAN, and general purpose baseband processing; Ceva-BX2 baseband processor; Ceva-Waves Bluetooth platform, a set of hardware IP, software modules, and radios addressing a range of processes and nodes; Ceva-Waves Wi-Fi platform, a set of hardware IP and CPU-agnostic host software for energy-efficient SoC implementation of Wi-Fi subsystems; Ceva-Waves ultra-wideband platform; Ceva-Waves Links, which provide solutions for SoCs requiring multiple connectivity standards; and Ceva-Waves DragonFly, a turnkey platform for implementing NB-IoT cellular modem SoCs. It also provides Ceva-SensPro, a family of DSP cores; Ceva-BX1 audio digital signal controller IP; Ceva-ClearVox ENC software, a neural-network-based noise cancellation; Ceva-RealSpace, a spatial audio and head tracking software solution; and Ceva-MotionEngine, a sensor fusion software. In addition, it offers Ceva-NeuPro-M, a neural processing unit (NPU) IP for generative AI; a Ceva-NeuPro-Nano, an NPU IP for embedded AI; and Ceva-NeuPro Studio, a software development environment for the development and deployment of AI models on the Ceva-NeuPro NPUs. The company was formerly known as ParthusCeva, Inc. and changed its name to CEVA, Inc. in December 2003. The company was incorporated in 1999 and is headquartered in Rockville, Maryland.
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