ACM Research, Inc. Class A Common Stock
ACM Research, Inc., together with its subsidiaries, develops, manufactures, and sells capital equipment worldwide. It also develops, manufactures, and sells a range of packaging tools to wafer assembly and packaging customers. The company provides Wet Cleaning Equipment for Front End Production Processes; Ultra C SAPS II and Ultra C SAPS V which are a single-wafer, serial-processing tool used to remove random defects from wafer surfaces or interconnects and barrier metals as part of the chip front-end fabrication process or for recycling test wafers; and Ultra C TEBO II and Ultra C TEBO V, a single-wafer, serial-processing tool used at numerous manufacturing processing steps for cleaning of chips at process nodes of 28nm or less. In addition, it offers Ultra-C Tahoe wafer cleaning tool that delivers high cleaning performance using significantly less sulfuric acid and hydrogen peroxide than is typically consumed by conventional high-temperature single-wafer cleaning tools; and advanced packaging tools, such as coaters, developers, photoresist strippers, scrubbers, wet etchers, and copper-plating tools. Further, the company provides e Ultra fn Furnace, a dry processing tool; Ultra Pmax" PECVD tool, for film uniformity; Ultra Track tool, a 300mm process tool that delivers air downflow, robot handling, and customizable software to address specific customer requirements; and a suite of semi-critical cleaning systems which include single wafer back side cleaning, scrubber, and auto bench cleaning tools. It markets and sells its products under the SAPS, TEBO, ULTRA C, ULTRA Fn, Ultra ECP, Ultra ECP map, and Ultra ECP ap trademarks through direct sales force and third-party representatives. ACM Research, Inc. was incorporated in 1998 and is headquartered in Fremont, California.
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Camtek Ltd., together with its subsidiaries, develops, manufactures, and sells inspection and metrology equipment for semiconductor industry in the United States, China, Korea, Europe, and the Asia Pacific. The company offers Hawk, a platform engineered for advanced packaging; Eagle G5 for enhanced detection and metrology; Eagle-i, a system that delivers 2D inspection and metrology capabilities; Eagle-AP, which addresses the advanced packaging market using software and hardware technologies that deliver 2D and 3D inspection and metrology capabilities on the same platform; and Golden Eagle, a panel inspection and metrology system to address the challenges fanout wafer level packaging applications, as well as automatic defect classification for color images utilizing deep learning techniques to reduce and eliminate manual verification. It also develops MicroProf AP, a wafer metrology tool for applications at 3D packaging process steps; MicroProf DI, an optical inspection tool that enables inspection of structured and unstructured wafers; MicroProf FE, a 2D/3D wafer metrology tool; MicroProf FS, a wafer metrology tool configurable; MicroProf PT for hybrid metrology applications to common panel sizes; MicroProf MHU metrology tool, a material handling unit for the semiconductor, MEMS, sapphire, and LED industries; MicroProf TL, an optical surface measurement tool for fully automatic 3D surface measurements; MicroProf 200, a measuring device for contactless and non-destructive characterization of surfaces and films; and MicroProf 300, a SurfaceSens technology for quality assurance, development, and manufacturing. The company serves semiconductor manufacturers, outsourced semiconductor assembly and test, integrated device manufacturers, and wafer level packaging subcontractors. Camtek Ltd. was incorporated in 1987 and is headquartered in Migdal HaEmek, Israel.
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