ACM Research, Inc. Class A Common Stock
ACM Research, Inc., together with its subsidiaries, develops, manufactures, and sells capital equipment worldwide. It also develops, manufactures, and sells a range of packaging tools to wafer assembly and packaging customers. The company provides Wet Cleaning Equipment for Front End Production Processes; Ultra C SAPS II and Ultra C SAPS V which are a single-wafer, serial-processing tool used to remove random defects from wafer surfaces or interconnects and barrier metals as part of the chip front-end fabrication process or for recycling test wafers; and Ultra C TEBO II and Ultra C TEBO V, a single-wafer, serial-processing tool used at numerous manufacturing processing steps for cleaning of chips at process nodes of 28nm or less. In addition, it offers Ultra-C Tahoe wafer cleaning tool that delivers high cleaning performance using significantly less sulfuric acid and hydrogen peroxide than is typically consumed by conventional high-temperature single-wafer cleaning tools; and advanced packaging tools, such as coaters, developers, photoresist strippers, scrubbers, wet etchers, and copper-plating tools. Further, the company provides e Ultra fn Furnace, a dry processing tool; Ultra Pmax" PECVD tool, for film uniformity; Ultra Track tool, a 300mm process tool that delivers air downflow, robot handling, and customizable software to address specific customer requirements; and a suite of semi-critical cleaning systems which include single wafer back side cleaning, scrubber, and auto bench cleaning tools. It markets and sells its products under the SAPS, TEBO, ULTRA C, ULTRA Fn, Ultra ECP, Ultra ECP map, and Ultra ECP ap trademarks through direct sales force and third-party representatives. ACM Research, Inc. was incorporated in 1998 and is headquartered in Fremont, California.
Open ACMR dashboard ↗Broadcom Inc. Common Stock
Broadcom Inc. designs, develops, and supplies various semiconductor devices and infrastructure software solutions worldwide. The company operates in two segments, Semiconductor Solutions and Infrastructure Software. It provides Ethernet switching and routing custom silicon solutions, optical and copper physical layer devices, and fiber optic transmitter and receiver components; set-top box system-on-chips (SoCs), data over cable service interface specifications cable modem and networking infrastructure, DSL access multiplexer/PON optical line termination products, and Wi-Fi access point SoCs, as well as digital subscriber line (DSL)/cable, passive optical networking (PON) gateways; and fiber optic components and mobile device connectivity solutions. The company also offers RF front end modules and filters; Wi-Fi, Bluetooth, and global positioning system/global navigation satellite system SoCs; custom touch controllers; inductive charging application specific integrated circuits; serial attached small computer system interface and redundant array of independent disks controllers and adapters, peripheral component interconnect express switches, fiber channel host bus adapters, read channel based SoCs, custom flash controllers, and preamplifiers; and optocouplers, industrial fiber optics, industrial and medical sensors, motion control encoders and subsystems, light emitting diodes, ethernet PHYs, switch ICs, and camera microcontrollers. Its products are used in various applications in enterprise and data center networking, including artificial intelligence networking and connectivity, home connectivity, set-top boxes, broadband access, telecommunication equipment, smartphones and base stations, data center servers and storage systems, factory automation, power generation and alternative energy systems, and electronic displays. Broadcom Inc. was founded in 1961 and is headquartered in Palo Alto, California.
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